{"id":360,"date":"2019-02-23T13:53:36","date_gmt":"2019-02-23T13:53:36","guid":{"rendered":"http:\/\/macktron\/?post_type=avada_portfolio&p=360"},"modified":"2021-11-05T09:29:59","modified_gmt":"2021-11-05T09:29:59","slug":"rigid-pcb","status":"publish","type":"avada_portfolio","link":"http:\/\/macktron.com\/en\/portfolio-items\/rigid-pcb\/","title":{"rendered":"Rigid PCB"},"content":{"rendered":"
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div>
\"Rigid<\/div><\/div><\/div><\/div>
<\/i><\/div>
<\/i><\/div><\/div><\/div>
Manufacturing Capabilities<\/th>\nTypical<\/th>\nAdvanced<\/th>\n<\/tr><\/thead>
Capabilities<\/td>\nLayer Count<\/td>\n2L - 68L<\/td>\n2L - 68L<\/td>\n<\/tr>
Base Material & Matching Prepreg<\/td>\nFR-4 (Standard\/medium\/high Tg, Different CTI, Halogen Free, CAF Resistant), RF materials (Rogers, Taconic, Arlon, BT etc), PTFE<\/td>\nFR-4 (Standard\/medium\/high Tg, Different CTI, Halogen Free, CAF Resistant), RF materials (Rogers, Taconic, Arlon, BT etc), PTFE<\/td>\n<\/tr>
Finished Brd. Thk.<\/td>\n0.30 mm - 10.00 mm<\/td>\n0.20 mm - 10.00 mm<\/td>\n<\/tr>
Finished Copper Wt.<\/td>\n0.5 oz - 10.0 oz (External), 0.25 oz - 4.00 oz (Internal)<\/td>\n0.5 oz - 10.0 oz (External), 0.25 oz - 9.00 oz (Internal)<\/td>\n<\/tr>
Min. Brd. Size<\/td>\n20.00 mm * 20.00 mm (In-board tooling holes)<\/td>\n10.00 mm * 10.00 mm<\/td>\n<\/tr>
Max. Brd. Size<\/td>\n23\" * 30\"(2L), 22\" * 28\"(\u22654L)<\/td>\n23\" * 30\"(2L), 22.5\" * 30\"(\u22654L)<\/td>\n<\/tr>
<\/td>\n<\/tr>
Surface Finish<\/td>\nRoHS Compliant<\/td>\nHAL (leadfree), Immersion Nickel Gold
\nGalvanic Nickel Gold, Immersion Tin
\nImmersion Silver, Hard Electroplated Gold for Contacts
\nChem. Nickel Palladium Gold, OSP
\nImmersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers
\nImmersion Nickel Gold + Gold Fingers, OSP + Gold Fingers<\/td>\n		HAL (leadfree), Immersion Nickel Gold
\nGalvanic Nickel Gold, Immersion Tin
\nImmersion Silver, Hard Electroplated Gold for Contacts
\nChem. Nickel Palladium Gold, OSP
\nImmersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers
\nImmersion Nickel Gold + Gold Fingers, OSP + Gold Fingers<\/td>\n<\/tr>
Non-RoHS Compliant<\/td>\nH.A.L. Leaded<\/td>\nH.A.L. Leaded<\/td>\n<\/tr>
<\/td>\n<\/tr>
Finish Coating Thk.<\/td>\nAspect Ratio for H.A.L<\/td>\n\u22645:1(plated hole dia. \u2265 0.30 mm)<\/td>\n\u22645:1(plated hole dia. \u2265 0.30 mm)<\/td>\n<\/tr>
H.A.L.(leaded & lead-free)<\/td>\n1 um - 40 um<\/td>\n1 um - 40 um<\/td>\n<\/tr>
OSP<\/td>\n0.2 um - 0.4 um<\/td>\n0.2 um - 0.4 um<\/td>\n<\/tr>
Immersion Nickel Gold<\/td>\n3 um - 5 um(nickle), 1 uin - 3 uin(gold)<\/td>\n3 um - 5 um(nickle), 1 uin - 4 uin(gold)<\/td>\n<\/tr>
Chem. Nickel Palladium Gold<\/td>\n\u2265 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold)<\/td>\n\u2265 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold)<\/td>\n<\/tr>
Immerison Silver<\/td>\n6 uin - 12 uin<\/td>\n6 uin - 12 uin<\/td>\n<\/tr>
Immersion Tin<\/td>\n\u2265 1 um<\/td>\n\u2265 1 um<\/td>\n<\/tr>
Galvanic Hard Gold<\/td>\n5 uin - 40 uin<\/td>\n5 uin - 80 uin<\/td>\n<\/tr>
Gold Finger\/Connector<\/td>\n1 uin - 40 uin<\/td>\n1 uin - 80 uin<\/td>\n<\/tr>
Blue Mask Thk.<\/td>\n0.20 mm - 0.60 mm<\/td>\n0.20 mm - 0.60 mm<\/td>\n<\/tr>
Carbon Ink Thk.<\/td>\n10 um - 50 um<\/td>\n10 um - 50 um<\/td>\n<\/tr>
<\/td>\n<\/tr>
Drill\/Hole<\/td>\nThrough Hole Aspect Ratio<\/td>\n28:1(drill dia. \u2265 0.30 mm)<\/td>\n28:1(drill dia. \u2265 0.30 mm)<\/td>\n<\/tr>
Microvia Aspect Ratio<\/td>\n0.8:1<\/td>\n1:01<\/td>\n<\/tr>
Min. Mechanical Drill<\/td>\n0.20 mm<\/td>\n0.10 mm<\/td>\n<\/tr>
Max. Mechanical Drill<\/td>\n6.30 mm<\/td>\n6.30 mm<\/td>\n<\/tr>
Mechanical Blind Drill<\/td>\n0.20 mm - 0.50 mm<\/td>\n0.20 mm - 0.70 mm<\/td>\n<\/tr>
Min. Laser Drill<\/td>\n0.10 mm (Single PP1080 thk.)<\/td>\n0.10 mm (Single PP1080 thk.)<\/td>\n<\/tr>
Max. Laser Drill<\/td>\n0.15 mm (Single PP3313 thk.)<\/td>\n0.15 mm (Single PP3313 thk.)<\/td>\n<\/tr>
Min. Drill for Material PTFE\/PTFE Composite<\/td>\n0.30 mm<\/td>\n0.30 mm<\/td>\n<\/tr>
Min. Half Hole Drill<\/td>\n0.50 mm<\/td>\n0.50 mm<\/td>\n<\/tr>
Min. Overlapped Drill<\/td>\n0.45 mm<\/td>\n0.45 mm<\/td>\n<\/tr>
Min. Backdrill<\/td>\n0.50 mm<\/td>\n0.50 mm<\/td>\n<\/tr>
Min. Dielectric Thk. for Backdrill<\/td>\n0.20 mm<\/td>\n0.20 mm<\/td>\n<\/tr>
Max. Hole for Bluemask Plugging<\/td>\n5.00 mm<\/td>\n5.00 mm<\/td>\n<\/tr>
Max. Hole for Soldermask Plugging<\/td>\n0.65 mm<\/td>\n0.65 mm<\/td>\n<\/tr>
Hole for Epoxy Fill<\/td>\n0.10 mm - 0.45 mm<\/td>\n0.10 mm - 0.70 mm<\/td>\n<\/tr>
Counter Bore\/Sink Hole Angle<\/td>\n130\u00b0(dia.\u22643.175 mm), 165\u00b0(dia. 3.175 mm - 6.300 mm)<\/td>\n82\u00b0, 90\u00b0, 100\u00b0, 135\u00b0(dia. 3.175 mm - 6.300 mm)<\/td>\n<\/tr>
Min. Mechanical Drill for Different Brd. Thk.<\/td>\n0.15 mm(brd. thk. \u2264 0.80 mm)<\/td>\n0.10 mm(brd. thk. \u2264 0.80 mm)<\/td>\n<\/tr>
0.15 mm(brd. thk. \u2264 1.40 mm)<\/td>\n0.15 mm(brd. thk. \u2264 1.20 mm)<\/td>\n<\/tr>
0.20 mm(brd. thk. \u2264 2.80 mm)<\/td>\n0.20 mm(brd. thk. \u2264 2.80 mm)<\/td>\n<\/tr>
Hole Position Tol.<\/td>\n\u00b13 mil<\/td>\n\u00b13 mil<\/td>\n<\/tr>
PTH Dia. Tol.<\/td>\n\u00b13 mil<\/td>\n\u00b13 mil<\/td>\n<\/tr>
NPTH Dia. Tol.<\/td>\n\u00b12 mil<\/td>\n\u00b12 mil, +2 mil - 0 mil, 0 mil - (-2) mil<\/td>\n<\/tr>
Pressfit Hole Dia. Tol.<\/td>\n\u00b12 mil<\/td>\n\u00b12 mil<\/td>\n<\/tr>
Drilled Slot Hole Tol.<\/td>\n\u00b10.05(L)\/0.05(W) mm(unplated)
\n\u00b10.13(L)\/0.10(W) mm(plated)<\/td>\n		\u00b10.05(L)\/0.05(W) mm(unplated)
\n\u00b10.13(L)\/0.10(W) mm(plated)<\/td>\n<\/tr>
Milled Slot Hole Tol.<\/td>\n\u00b10.10(L)\/0.10(W) mm(unplated)
\n\u00b10.13(L)\/0.13(W) mm(plated)<\/td>\n		\u00b10.10(L)\/0.10(W) mm(unplated)
\n\u00b10.13(L)\/0.13(W) mm(plated)<\/td>\n<\/tr>
Backdrill Depth Tol.<\/td>\n\u00b14 mil<\/td>\n\u00b14 mil<\/td>\n<\/tr>
Counter Bore\/Sink Hole Angle Tol.<\/td>\n\u00b110\u00b0<\/td>\n\u00b110\u00b0<\/td>\n<\/tr>
Counter Bore\/Sink Hole Dia. Tol.<\/td>\n\u00b10.20 mm<\/td>\n\u00b10.20 mm<\/td>\n<\/tr>
Counter Bore\/Sink Hole Depth Tol.<\/td>\n\u00b10.15 mm<\/td>\n\u00b10.15 mm<\/td>\n<\/tr>
<\/td>\n<\/tr>
Inner Layer Base Copper VS Line Width\/Space<\/td>\n18um (1\/2OZ)<\/td>\n3\/3mil<\/td>\n2.5\/2.5mil<\/td>\n<\/tr>
35um (1OZ)<\/td>\n3.5\/3.5mil or 3\/4mil<\/td>\n3.5\/3.5mil or 3\/4mil<\/td>\n<\/tr>
70um (2OZ)<\/td>\n5.5\/5.5mil<\/td>\n5.5\/5.5mil<\/td>\n<\/tr>
105um (3OZ)<\/td>\n6.5\/6.5mil<\/td>\n6.5\/6.5mil<\/td>\n<\/tr>
140um (4OZ)<\/td>\n8\/8mil<\/td>\n8\/8mil<\/td>\n<\/tr>
175um (5OZ)<\/td>\n10\/10mil<\/td>\n10\/10mil<\/td>\n<\/tr>
210um (6OZ)<\/td>\n12\/12 mil<\/td>\n12\/12 mil<\/td>\n<\/tr>
Outer Layer Base Copper VS Line Width\/Space<\/td>\n7-9um<\/td>\n3\/3mil<\/td>\n3\/3mil<\/td>\n<\/tr>
12um<\/td>\n3.5\/3.5mil<\/td>\n3.5\/3.5mil<\/td>\n<\/tr>
18um (1\/2OZ)<\/td>\n4.5\/4.5mil<\/td>\n4.5\/4.5mil<\/td>\n<\/tr>
35um (1OZ)<\/td>\n5\/5mil<\/td>\n5\/5mil<\/td>\n<\/tr>
70um (2OZ)<\/td>\n9\/9mil<\/td>\n8\/8mil<\/td>\n<\/tr>
105um (3OZ)<\/td>\n10\/10mil<\/td>\n10\/10mil<\/td>\n<\/tr>
140um (4OZ)<\/td>\n13\/13mil<\/td>\n10\/13mil<\/td>\n<\/tr>
175um (5OZ)<\/td>\n14\/14mil<\/td>\n12\/15mil<\/td>\n<\/tr>
<\/td>\n<\/tr>
Copper Feature<\/td>\nMin. Annular Ring<\/td>\n4 mil<\/td>\n4 mil(partially 3.5 mil)<\/td>\n<\/tr>
Min. BGA Pad Dia.<\/td>\n10 mil(excluding H.A.L)<\/td>\n8 mil(excluding H.A.L)<\/td>\n<\/tr>
Min. BGA Pad Dia. for Leaded H.A.L.<\/td>\n10 mil<\/td>\n10 mil<\/td>\n<\/tr>
Min. BGA Pad Dia. for Lead-free H.A.L.<\/td>\n12 mil<\/td>\n12 mil<\/td>\n<\/tr>
Min. Pad Size for H.A.L.<\/td>\n7 mil * 16 mil<\/td>\n7 mil * 16 mil<\/td>\n<\/tr>
<\/td>\n<\/tr>
Solder Mask<\/td>\nColor<\/td>\nGreen(matt\/glossy), Yellow, Black(matt\/glossy), Blue, Red, White, Orange<\/td>\nGreen(matt\/glossy), Yellow, Black(matt\/glossy), Blue, Red, White, Orange<\/td>\n<\/tr>
Min. Soldermask Web<\/td>\n0.10 mm<\/td>\n0.075 mm<\/td>\n<\/tr>
Min. Soldermask to Pad Clearance<\/td>\n0.10 mm<\/td>\n0.10 mm<\/td>\n<\/tr>
Min. Soldermask Track Cover<\/td>\n0.10 mm<\/td>\n0.10 mm<\/td>\n<\/tr>
Soldermask Thk. on Copper<\/td>\n10 um - 18 um<\/td>\n10 um - 18 um<\/td>\n<\/tr>
Soldermask Thk. at Shoulder<\/td>\n\u2265 5 um(one-time printing)<\/td>\n\u2265 5 um(one-time printing)<\/td>\n<\/tr>
Soldermask Thk. over Hole<\/td>\n\u2265 5 um<\/td>\n\u2265 5 um<\/td>\n<\/tr>
<\/td>\n<\/tr>
Legend<\/td>\nColor<\/td>\nWhite, Yellow, Black, Orange<\/td>\nWhite, Yellow, Black, Orange<\/td>\n<\/tr>
Min. Stroke Width<\/td>\n0.17 mm<\/td>\n0.17 mm<\/td>\n<\/tr>
Min. Height for Legibility<\/td>\n1.00 mm<\/td>\n1.00 mm<\/td>\n<\/tr>
Min. Legend to Pad Clearance<\/td>\n4 mil<\/td>\n4 mil<\/td>\n<\/tr>
<\/td>\n<\/tr>
Profiling<\/td>\nPanelization<\/td>\nV-score, Tab-routing, Tab-routing & Perforation,
\n Tab-routing & V-score, Tab-routing & V-score & Perforation<\/td>\n		V-score, Tab-routing, Tab-routing & Perforation,
\n Tab-routing & V-score, Tab-routing & V-score & Perforation<\/td>\n<\/tr>
V-score Angle<\/td>\n20\u00b0, 30\u00b0, 60\u00b0<\/td>\n20\u00b0, 30\u00b0, 60\u00b0<\/td>\n<\/tr>
Brd. Thk. for Double-side V-score<\/td>\n0.80 mm - 3.20 mm<\/td>\n0.80 mm - 3.20 mm<\/td>\n<\/tr>
Brd. Thk. for Single-side V-score<\/td>\n0.60 mm - 0.80 mm<\/td>\n0.60 mm - 0.80 mm<\/td>\n<\/tr>
Min. Inside Corner Radius<\/td>\n0.40 mm<\/td>\n0.30 mm<\/td>\n<\/tr>
<\/td>\n<\/tr>
Gold Fingers\/Edge Connectors<\/td>\nEdge Beveling Angle<\/td>\n30\u00b0, 45\u00b0<\/td>\n30\u00b0, 45\u00b0<\/td>\n<\/tr>
Edge Chamfering Corner<\/td>\n45\u00b0<\/td>\n45\u00b0<\/td>\n<\/tr>
Min. Notch Width beside Edge Connector <\/td>\n0.20 mm<\/td>\n0.20 mm<\/td>\n<\/tr>
Edge Beveling Depth<\/td>\n0.50 mm<\/td>\n0.50 mm<\/td>\n<\/tr>
Min. Finger Top to Copper Distance<\/td>\n3.00 mm<\/td>\n2.00 mm<\/td>\n<\/tr>
Min. Finger Bot. to Brd. Outline<\/td>\n7.00 mm<\/td>\n6.00 mm<\/td>\n<\/tr>
Min. Finger to Finger Clearance<\/td>\n6 mil<\/td>\n5 mil<\/td>\n<\/tr>
Edge Beveling Angle Tol.<\/td>\n\u00b15\u00b0<\/td>\n\u00b15\u00b0<\/td>\n<\/tr>
Edge Beveling Remaining Thk. Tol.<\/td>\n\u00b15 mil<\/td>\n\u00b15 mil<\/td>\n<\/tr>
<\/td>\n<\/tr>
Profile<\/td>\nBrd. Dimension Tol.<\/td>\n\u00b10.10 mm<\/td>\n\u00b10.10 mm<\/td>\n<\/tr>
Inside Cutout Position Tol.<\/td>\n\u00b10.10 mm<\/td>\n\u00b10.10 mm<\/td>\n<\/tr>
V-score Angle Tol.<\/td>\n\u00b15\u00b0<\/td>\n\u00b15\u00b0<\/td>\n<\/tr>
V-score Web Thk. Tol.<\/td>\n\u00b10.05 mm<\/td>\n\u00b10.05 mm<\/td>\n<\/tr>
V-scores Offset Tol.<\/td>\n\u00b10.10 mm<\/td>\n\u00b10.10 mm<\/td>\n<\/tr>
<\/td>\n<\/tr>
Others<\/td>\nBrd. Thk. for Epoxy Fill<\/td>\n0.50 mm - 6.50 mm<\/td>\n0.40 mm - 6.50 mm<\/td>\n<\/tr>
Min. Channel for Internal Split Plane<\/td>\n8 mil<\/td>\n8 mil<\/td>\n<\/tr>
Bow & Twist<\/td>\n0.75%<\/td>\n0.50%<\/td>\n<\/tr>
Brd. Thk. Tol.<\/td>\n\u00b10.10 mm(thk.\u22641.00 mm), \u00b110%(thk.>1.00 mm)<\/td>\n\u00b10.10 mm(thk.\u22642.00 mm), \u00b10.15(2.10\u2264thk.\u22643.00 mm)<\/td>\n<\/tr>
Impedance Control Tol.<\/td>\n\u00b15\u03a9(<50\u03a9), \u00b110%(\u226550\u03a9)<\/td>\n\u00b15\u03a9(<50\u03a9), \u00b18%(\u226550\u03a9)<\/td>\n<\/tr>
Trace Width\/Space Tol.<\/td>\n\u00b11.0 mil(\u226410 mil), \u00b11.5 mil(>10 mil)<\/td>\n\u00b11.0 mil(\u226410 mil), \u00b11.5 mil(>10 mil)<\/td>\n<\/tr>
Layer to Layer Registration Tol.<\/td>\n\u22642 mil<\/td>\n\u22642 mil<\/td>\n<\/tr>
Min. Trace Width\/Space for Epoxy Fill<\/td>\n4.0 mil \/ 4.0 mil<\/td>\n3.5 mil \/ 3.5 mil<\/td>\n<\/tr><\/tbody><\/table><\/div>