{"id":329,"date":"2019-02-23T09:22:48","date_gmt":"2019-02-23T09:22:48","guid":{"rendered":"http:\/\/macktron\/?page_id=329"},"modified":"2021-11-11T09:45:37","modified_gmt":"2021-11-11T09:45:37","slug":"hdi-pcb","status":"publish","type":"page","link":"http:\/\/macktron.com\/en\/hdi-pcb\/","title":{"rendered":"HDI PCB"},"content":{"rendered":"
\"\"<\/div>

HDI PCB<\/h2>Layer Count: 10<\/div><\/div>
\n

\nLayer Count: 10
\nThickness: 2.60 mm
\nPanel Size: 181.00 * 182.50 mm
\nMin. Hole: 8.00 mil
\nAspect Ratio: 12.80:1
\nMin. Trace\/Space: 4.0\/4.06 mil
\nSurface Finish: ENIG
\nAdditional Features:
\n2 Level HDI
\nControlled Impedance
\n8 mil BGA
\nApplication: Medical\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 8<\/div><\/div>
\n

\nLayer Count: 8
\nThickness: 1.57 mm
\nPanel Size: 213.68 * 119.49 mm
\nMin. Hole: 8 mil
\nAspect Ratio: 7.73:1
\nMin. Trace\/Space: 4.0\/8.80 mil
\nSurface Finish: ENIG
\nAdditional Features:
\n3 Level HDI
\n8 mil BGA
\n20uin gold fingers
\nApplication: Security\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 28<\/div><\/div>
\n

\nLayer Count: 28
\nThickness: 5.08 mm
\nMin. Hole: 24.00 mil
\nAspect Ratio: 8.33:1
\nMin. Trace\/Space: 6.0\/6.80 mil
\nSurface Finish: ENIG
\nAdditional Features:
\n3 Level HDI
\nControlled impedance
\nDepth-controlled drill
\nApplication: Semiconductor Test\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 4<\/div><\/div>
\n

\nLayer Count: 4
\nThickness: 1.60 mm
\nMin. Hole: 8 mil
\nAspect Ratio: 7.87:1
\nMin. Trace\/Space: 3.50\/8.0 mil
\nSurface Finish: ENIG
\nAdditional Features:
\n1 pressing cycle
\n1 cycle laser drill
\nResin Fill 1 cycle
\nBGA to Conductor 4 mil
\nApplication: Automotive\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 6<\/div><\/div>
\n

\nLayer Count: 6
\nThickness: 1.60 mm
\nPanel Size: 356.16 * 224.50 mm
\nMin. Hole: 8 mil
\nAspect Ratio: 7.87:1
\nMin. Trace\/Space: 4.2\/6.0 mil
\nSurface Finish: ENIG
\nAdditional Features:
\nDRL5-6\u00a0(4 mil)
\n1 pressing cycle
\nLaser\u00a0drill\u00a01\u00a0cycle
\nResin\u00a0Fill 1 cycle
\nApplication: Consumer\u00a0Electronics\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 12<\/div><\/div>
\n

\nLayer Count: 12
\nThickness: 1.60 mm
\nPanel Size: 242.50 * 140.08 mm
\nMin. Hole: 8.0 mil
\nAspect Ratio: 7.87:1
\nMin. Trace\/Space: 5.0\/8.80 mil
\nSurface Finish: ENIG
\nAdditional Features:
\nVia-In-Pad
\n20uin gold fingers
\nLaser drill 2 cycles
\nResin\u00a0Fill 1 cycle
\nApplication: Industrial Control\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 18<\/div><\/div>
\n

\nLayer Count: 18
\nThickness: 4.0 mm
\nPanel Size: 340.09 * 330.98 mm
\nMin. Hole: 28 mil
\nAspect Ratio: 5.62:1
\nMin. Trace\/Space: 12.0\/16.08 mil
\nSurface Finish: ENEPIG
\nAdditional Features:
\nCopper Fill 2 cycles
\n3 pressing cycles
\n2 Level HDI
\nControlled impedance
\nApplication: Semiconductor Test\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

HDI PCB<\/h2>Layer Count: 18<\/div><\/div>
\n

\nLayer Count: 18
\nThickness: 3.20 mm
\nPanel Size: 344.96 * 319.83 mm
\nMin. Hole: 8 mil
\nAspect Ratio: 15.75:1
\nMin. Trace\/Space: 6.0\/6.0 mil
\nControlled Impedance: Yes
\nSurface Finish: ENIG
\nAdditional Features:
\n1 mechanical drill
\n3 pressing cycles
\nLaser drill 2 cycles
\nApplication: Semiconductor Test\n<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>

<\/div>
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