| Manufacturing Capabilities | Typical | Advanced | |
|---|---|---|---|
| Product Structure | Structure Type | Symmetrical, asymmetrical | Symmetrical, asymmetrical, hollow |
| Base Material | Flex Material | PI | PI, PET, LCP |
| Insulating Material | Coverylay | Coverylay, Flex Solder Mask | |
| Coverlay Color | Yellow, Black | Yellow, Black, White | |
| Layer Count | Max. Layer Count | 4L | 8L |
| Board Thickness (Exclude Stiffener) | Min. Brd. Thk. Single-sided board | 0.1±0.05mm | 0.1±0.05mm |
| Min. Brd. Thk. Double-sided board | 0.2±0.05mm | 0.2±0.05mm | |
| Board Tolerance | Board tolerance | Flex: ±0.05mm Flex +Stiffener: ±0.1mm |
Flex: ±0.05mm Flex +Stiffener: ±0.1mm |
| Drill Size | Min. Drill Size | 0.2mm | 0.15mm |
| Annular Ring | Min. Annular Ring | ≥6mil | ≥4mil |
| Dimensions | Max. Board Dimensions | 220mm*380mm | 220mm*380mm |
| Min. Board Dimensions | 10*20mm | 5*10mm | |
| Dimensional Tolerance | Flex Part | +/-0.1mm | n+/-0.05mm |
| Max. Copper Thickness | Max. Inner Layer Copper | 1 OZ | 2 OZ |
| Outer Layer Finished Copper | 1 OZ | 2 OZ | |
| Surface Finish | RoHS Compliant | Immersion Nickel Gold, Immersion Tin Immersion Silver, Chem. Nickel Palladium Gold, OSP |
Immersion Nickel Gold, Immersion Tin Immersion Silver, Chem. Nickel Palladium Gold, OSP |
| Others | EMI Shield | Black | Black |
| Impedance Control Tol. | 50Ω+/-5Ω 100Ω+/-10% |
50Ω+/-5Ω 100Ω+/-10% |
|