{"id":849,"date":"2019-03-06T05:56:28","date_gmt":"2019-03-06T05:56:28","guid":{"rendered":"http:\/\/macktron\/?page_id=849"},"modified":"2021-11-06T13:04:13","modified_gmt":"2021-11-06T13:04:13","slug":"rf-and-microwave-pcb","status":"publish","type":"page","link":"https:\/\/macktron.com\/en\/rf-and-microwave-pcb\/","title":{"rendered":"RF and Microwave PCB"},"content":{"rendered":"
\nLayer Count: 8
\nThickness: 1.00 mm
\nMin. Hole: 0.2 mm
\nAspect Ratio: 5:1
\nMin. Trace\/Space: 4.10\/7.80 mil
\nAdditional Features:
\nL1-4 & L5-8 Blind vias
\n2 pressing cycles
\n2 Resin Fill cycles
\nS1000-2M & RO4350B composite
\nControlled impedance\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count\uff1a2
\nThickness\uff1a0.15 mm
\nPanel Size: 76.00 * 44.00 mm
\nAdditional Features:
\nSoft gold
\nRO4350B substrate
\nSelective 78.74u” gold\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count: 2
\nThickness: 1.60 mm
\nMin. Hole: 0.20 mm
\nAspect Ratio: 8:1
\nMin. Trace\/Space: 0.10 mm
\nSurface Finish: ENIG
\nAdditional Features:
\nRO5880 material
\nApplication: telecommunication\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count\uff1a8
\nThickness\uff1a1.10 mm
\nMin. Hole: 0.2 mm
\nAspect Ratio: 5.5:1
\nMin. Trace\/Space\uff1a7.87\/5.80 mil
\nAdditional Features:
\nL1-L7 Blind via
\n2 pressing cycles
\n2 Resin Fill cycles
\nIT180a & RO4350B composite
\nSoft gold
\nSelective 40u” gold\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count\uff1a12
\nThickness\uff1a1.50 mm
\nMin. hole: 0.2 mm
\nAspect Ratio: 7.5:1
\nMin. Trace\/Space\uff1a3.90\/5.90 mil
\nAdditional Features:
\nL1-L10 Blind via
\n2 pressing cycles
\n2 Resin Fill cycles
\nS1000-2M & RO4350B composite
\nSoft gold
\nSelective 40u” gold
\nPTH Slot Holes\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count\uff1a2
\nThickness\uff1a0.15 mm
\nPanel Size: 92.50 * 100.00 mm
\nAdditional Features:
\nSoft gold
\nSelective 78.74u” gold
\nRogers RO5880 Substrate\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count: 2
\nThickness: 1.60 mm
\nMin. Hole: 0.20 mm
\nAspect Ratio: 8:1
\nMin. Trace\/Space: 0.10 mm
\nSurface Finish: ENIG
\nAdditional Features:
\nPTFE Material
\nApplication: telecommunication\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>
\nLayer Count\uff1a2
\nThickness\uff1a0.31 mm
\nPanel Size: 53.95 * 73.09 mm
\nAdditional Features:
\nENEPIG
\nRO4350B Substrate
\nApplication: remote controller\n<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>