{"id":864,"date":"2019-03-06T07:31:48","date_gmt":"2019-03-06T07:31:48","guid":{"rendered":"http:\/\/macktron\/?page_id=864"},"modified":"2021-11-06T09:23:59","modified_gmt":"2021-11-06T09:23:59","slug":"multi-layer-pcb","status":"publish","type":"page","link":"https:\/\/macktron.com\/en\/multi-layer-pcb\/","title":{"rendered":"Multi-layer PCB"},"content":{"rendered":"
\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 16<\/div><\/div>
\n

\nLayer Count: 16
\nThickness: 2.0 mm
\nMin. Hole: 8.0 mil
\nAspect Ratio: 9.84:1
\nMin. Trace\/Space: 6.0\/6.0 mil
\nSurface Finish: ENIG
\nAdditional Features:
\nControlled Impedance
\nResin Filled Vias\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 18<\/div><\/div>
\n

\nLayer Count: 18
\nThickness: 2.62+\/-0.157 mm
\nPanel Size: 182 * 180 mm
\nMin. Hole: 9.84 mil
\nAspect Ratio: 10.48:1
\nMin. Trace\/Space: 3.94\/4.9 mil
\nControlled Impedance: Yes
\nSurface Finish: ENIG
\nApplication: Medical\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 14<\/div><\/div>
\n

\nLayer Count: 14
\nThickness: 1.60 mm
\nPanel Size: 318.26 * 180 mm
\nMin. Hole: 8.0mil
\nAspect Ratio: 7.87:1
\nMin. Trace\/Space: 3.0\/3.06 mil
\nSurface Finish: ENIG
\nAdditional Features:
\n8mil BGA, Resin Fill
\nControlled Impedance
\nApplication: Security\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 16<\/div><\/div>
\n

\nLayer Count: 16
\nThickness: 2.14 mm
\nPanel Size: 269.00 * 172.62 mm
\nMin. Hole: 12.00 mil
\nAspect Ratio: 7.02:1
\nMin. Trace\/Space: 22.00\/34.04 mil
\nSurface Finish: ENIG
\nApplication: Communication\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 18<\/div><\/div>
\n

\nLayer Count: 18
\nThickness: 2.36 mm
\nPanel Size: 304.96 * 186.50 mm
\nMin. Hole Size: 12.00 mil
\nAspect Ratio: 7.74:1
\nMin. Trace\/Space: 3.0\/8.0 mil
\nSurface Finish: ENIG
\nApplication: Consumer Electronics\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 28<\/div><\/div>
\n

\nLayer Count: 28
\nThickness: 5.03 mm
\nPanel Size:\u00a0433.06\u00a0*\u00a0373.20\u00a0mm
\nMin. Hole: 20.62 mil
\nAspect Ratio: 9.60:1
\nMin. Trace\/Space: 6.0 \/8.32 mil
\nSurface Finish: ENIG
\nAdditional Features:
\nBackplane
\nApplication: Industrial Control\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 22<\/div><\/div>
\n

\nLayer Count: 22
\nThickness: 5.00 mm
\nPanel Size:\u00a0403.50 * 404.50 mm
\nMin. Hole: 24.06 mil
\nAspect Ratio: 8.18: 1
\nMin. Trace\/Space: 10.00\/10.00 mil
\nSurface Finish: ENEPIG
\nAdditional Features:
\nStepped Hole
\nApplication: Semiconductor Test\n<\/p>\n<\/div><\/div><\/div><\/div><\/div>

\"\"<\/div>

Multi-layer PCB<\/h2>Layer Count: 16<\/div><\/div>
\n

Layer Count: 16
Thickness: 3.8 mm
Min. Hole: 10 mil
Aspect Ratio: 14.96:1
Min. Trace\/Space: 4.00\/3.91 mil
Cu Thk.: 5\/2\/1\/\u2026\/1\/2\/5 OZ
Additional Features:
1-3 & 14-16 stacked microvias
2 pressing cycles
Resin Fill 2 cycles
Depth-controlled drill
Blind Slot Routing<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div>

<\/div>
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