Flex PCB Capability

Manufacturing Capabilities Typical Advanced
Product Structure Structure Type Symmetrical, asymmetrical Symmetrical, asymmetrical, hollow
Base Material Flex Material PI PI, PET, LCP
Insulating Material Coverylay Coverylay, Flex Solder Mask
Coverlay Color Yellow, Black Yellow, Black, White
Layer Count Max. Layer Count 4L 8L
Board Thickness (Exclude Stiffener) Min. Brd. Thk. Single-sided board 0.1±0.05mm 0.1±0.05mm
Min. Brd. Thk. Double-sided board 0.2±0.05mm 0.2±0.05mm
Board Tolerance Board tolerance Flex: ±0.05mm
Flex +Stiffener: ±0.1mm
Flex: ±0.05mm
Flex +Stiffener: ±0.1mm
Drill Size Min. Drill Size 0.2mm 0.15mm
Annular Ring Min. Annular Ring ≥6mil ≥4mil
Dimensions Max. Board Dimensions 220mm*380mm 220mm*380mm
Min. Board Dimensions 10*20mm 5*10mm
Dimensional Tolerance Flex Part +/-0.1mm n+/-0.05mm
Max. Copper Thickness Max. Inner Layer Copper 1 OZ 2 OZ
Outer Layer Finished Copper 1 OZ 2 OZ
Surface Finish RoHS Compliant Immersion Nickel Gold, Immersion Tin
Immersion Silver, Chem. Nickel Palladium Gold, OSP
Immersion Nickel Gold, Immersion Tin
Immersion Silver, Chem. Nickel Palladium Gold, OSP
Others EMI Shield Black Black
Impedance Control Tol. 50Ω+/-5Ω
100Ω+/-10%
50Ω+/-5Ω
100Ω+/-10%