Rigid-flex PCB Capability

Manufacturing Capabilities		Typical	Advanced
Product Structure	Rigid-Flex Structure	N+F+N	F+N N+F+N 1+F+1
Base Material	Flex Material	PI	PI PET LCP
	Rigid Material	High Tg FR4	High Tg FR4 PTFE Ceramics
	Stiffener Material	PI, FR4, Stainless Steel, Aluminum	PI, FR4, Stainless Steel, Aluminum
	Flexible Coating	Coverlay	Coverylay Flex Solder Mask
Color	Rigid Section	Green (Matt/glossy), Yellow, Black (Matt/glossy), Blue, Red, White, Orange	Green (Matt/glossy), Yellow, Black (Matt/glossy), Blue, Red, White, Orange
Color	Flex Section	Yellow, Black	Yellow, Black, White
Layer Count	Rigid Section	12	18
Layer Count	Flex Section	4	6
Board Thickness	Rigid Section (Includes Flex layer)	0.5mm-5.0mm	0.3mm-7.0mm
Board Thickness	Flex Section	0.15-0.3mm	0.1-0.4mm
Dimensions	Max. Brd. Size	220mm*380mm	220mm*380mm
Dimensions	Min. Brd. Size	20*20mm (In-board tooling holes)	10*10mm
Dimensional Tolerance	Rigid Section	+/-0.15mm	+/-0.1mm
Dimensional Tolerance	Flex Section	+/-0.1mm	+/-0.05mm
Max. Copper Thickness	Inner Layer	1 OZ	2 OZ
Max. Copper Thickness	Outer Layer (Flex part in inner layer)	3 OZ	8 OZ
Hole-to-Flexible Distance	Hole-to-Flexible Distance	1.5mm	1.0mm
Aspect Ratio	Rigid Section	12:01	16:01
Min. Dielectric Thickness	Inner Layer Flex Core	0.025mm	0.0125mm
	Inner Layer Rigid Core	0.1mm	0.075mm
	Prepreg Type	1080	106 1080
Surface Finish	RoHS Compliant	HAL (leadfree), Immersion Nickel Gold Galvanic Nickel Gold, Immersion Tin Immersion Silver, Hard Electroplated Gold for Contacts Chem. Nickel Palladium Gold, OSP Immersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers Immersion Nickel Gold + Gold Fingers, OSP + Gold Fingers	HAL (leadfree), Immersion Nickel Gold Galvanic Nickel Gold, Immersion Tin Immersion Silver, Hard Electroplated Gold for Contacts Chem. Nickel Palladium Gold, OSP Immersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers Immersion Nickel Gold + Gold Fingers, OSP + Gold Fingers
Surface Finish	Non-RoHS Compliant	H.A.L. Leaded	H.A.L. Leaded