Rigid-flex PCB Capability

Manufacturing Capabilities Typical Advanced
Product Structure Rigid-Flex Structure N+F+N F+N
N+F+N
1+F+1
Base Material Flex Material PI PI
PET
LCP
Rigid Material High Tg FR4 High Tg FR4
PTFE
Ceramics
Stiffener Material PI, FR4, Stainless Steel, Aluminum PI, FR4, Stainless Steel, Aluminum
Flexible Coating Coverlay Coverylay
Flex Solder Mask
Color Rigid Section Green (Matt/glossy), Yellow, Black (Matt/glossy), Blue, Red, White, Orange Green (Matt/glossy), Yellow, Black (Matt/glossy), Blue, Red, White, Orange
Flex Section Yellow, Black Yellow, Black, White
Layer Count Rigid Section 12 18
Flex Section 4 6
Board Thickness Rigid Section (Includes Flex layer) 0.5mm-5.0mm 0.3mm-7.0mm
Flex Section 0.15-0.3mm 0.1-0.4mm
Dimensions Max. Brd. Size 220mm*380mm 220mm*380mm
Min. Brd. Size 20*20mm (In-board tooling holes) 10*10mm
Dimensional Tolerance Rigid Section +/-0.15mm +/-0.1mm
Flex Section +/-0.1mm +/-0.05mm
Max. Copper Thickness Inner Layer 1 OZ 2 OZ
Outer Layer (Flex part in inner layer) 3 OZ 8 OZ
Hole-to-Flexible Distance Hole-to-Flexible Distance 1.5mm 1.0mm
Aspect Ratio Rigid Section 12:01 16:01
Min. Dielectric Thickness Inner Layer Flex Core 0.025mm 0.0125mm
Inner Layer Rigid Core 0.1mm 0.075mm
Prepreg Type 1080 106
1080
Surface Finish RoHS Compliant HAL (leadfree), Immersion Nickel Gold
Galvanic Nickel Gold, Immersion Tin
Immersion Silver, Hard Electroplated Gold for Contacts
Chem. Nickel Palladium Gold, OSP
Immersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers
Immersion Nickel Gold + Gold Fingers, OSP + Gold Fingers
HAL (leadfree), Immersion Nickel Gold
Galvanic Nickel Gold, Immersion Tin
Immersion Silver, Hard Electroplated Gold for Contacts
Chem. Nickel Palladium Gold, OSP
Immersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers
Immersion Nickel Gold + Gold Fingers, OSP + Gold Fingers
Non-RoHS Compliant H.A.L. Leaded H.A.L. Leaded