Rigid PCB Capability

Manufacturing Capabilities Typical Advanced
Capabilities Layer Count 2L - 68L 2L - 68L
Base Material & Matching Prepreg FR-4 (Standard/medium/high Tg, Different CTI, Halogen Free, CAF Resistant), RF materials (Rogers, Taconic, Arlon, BT etc), PTFE FR-4 (Standard/medium/high Tg, Different CTI, Halogen Free, CAF Resistant), RF materials (Rogers, Taconic, Arlon, BT etc), PTFE
Finished Brd. Thk. 0.30 mm - 10.00 mm 0.20 mm - 10.00 mm
Finished Copper Wt. 0.5 oz - 10.0 oz (External), 0.25 oz - 4.00 oz (Internal) 0.5 oz - 10.0 oz (External), 0.25 oz - 9.00 oz (Internal)
Min. Brd. Size 20.00 mm * 20.00 mm (In-board tooling holes) 10.00 mm * 10.00 mm
Max. Brd. Size 23" * 30"(2L), 22" * 28"(≥4L) 23" * 30"(2L), 22.5" * 30"(≥4L)
Surface Finish RoHS Compliant HAL (leadfree), Immersion Nickel Gold
Galvanic Nickel Gold, Immersion Tin
Immersion Silver, Hard Electroplated Gold for Contacts
Chem. Nickel Palladium Gold, OSP
Immersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers
Immersion Nickel Gold + Gold Fingers, OSP + Gold Fingers		 HAL (leadfree), Immersion Nickel Gold
Galvanic Nickel Gold, Immersion Tin
Immersion Silver, Hard Electroplated Gold for Contacts
Chem. Nickel Palladium Gold, OSP
Immersion Nickel Gold + OSP, HAL (leadfree) + Gold Fingers
Immersion Nickel Gold + Gold Fingers, OSP + Gold Fingers
Non-RoHS Compliant H.A.L. Leaded H.A.L. Leaded
Finish Coating Thk. Aspect Ratio for H.A.L ≤5:1(plated hole dia. ≥ 0.30 mm) ≤5:1(plated hole dia. ≥ 0.30 mm)
H.A.L.(leaded & lead-free) 1 um - 40 um 1 um - 40 um
OSP 0.2 um - 0.4 um 0.2 um - 0.4 um
Immersion Nickel Gold 3 um - 5 um(nickle), 1 uin - 3 uin(gold) 3 um - 5 um(nickle), 1 uin - 4 uin(gold)
Chem. Nickel Palladium Gold ≥ 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold) ≥ 5 um(nickle), 1 uin - 6 uin(palladium), 1 uin - 6 uin(gold)
Immerison Silver 6 uin - 12 uin 6 uin - 12 uin
Immersion Tin ≥ 1 um ≥ 1 um
Galvanic Hard Gold 5 uin - 40 uin 5 uin - 80 uin
Gold Finger/Connector 1 uin - 40 uin 1 uin - 80 uin
Blue Mask Thk. 0.20 mm - 0.60 mm 0.20 mm - 0.60 mm
Carbon Ink Thk. 10 um - 50 um 10 um - 50 um
Drill/Hole Through Hole Aspect Ratio 28:1(drill dia. ≥ 0.30 mm) 28:1(drill dia. ≥ 0.30 mm)
Microvia Aspect Ratio 0.8:1 1:01
Min. Mechanical Drill 0.20 mm 0.10 mm
Max. Mechanical Drill 6.30 mm 6.30 mm
Mechanical Blind Drill 0.20 mm - 0.50 mm 0.20 mm - 0.70 mm
Min. Laser Drill 0.10 mm (Single PP1080 thk.) 0.10 mm (Single PP1080 thk.)
Max. Laser Drill 0.15 mm (Single PP3313 thk.) 0.15 mm (Single PP3313 thk.)
Min. Drill for Material PTFE/PTFE Composite 0.30 mm 0.30 mm
Min. Half Hole Drill 0.50 mm 0.50 mm
Min. Overlapped Drill 0.45 mm 0.45 mm
Min. Backdrill 0.50 mm 0.50 mm
Min. Dielectric Thk. for Backdrill 0.20 mm 0.20 mm
Max. Hole for Bluemask Plugging 5.00 mm 5.00 mm
Max. Hole for Soldermask Plugging 0.65 mm 0.65 mm
Hole for Epoxy Fill 0.10 mm - 0.45 mm 0.10 mm - 0.70 mm
Counter Bore/Sink Hole Angle 130°(dia.≤3.175 mm), 165°(dia. 3.175 mm - 6.300 mm) 82°, 90°, 100°, 135°(dia. 3.175 mm - 6.300 mm)
Min. Mechanical Drill for Different Brd. Thk. 0.15 mm(brd. thk. ≤ 0.80 mm) 0.10 mm(brd. thk. ≤ 0.80 mm)
0.15 mm(brd. thk. ≤ 1.40 mm) 0.15 mm(brd. thk. ≤ 1.20 mm)
0.20 mm(brd. thk. ≤ 2.80 mm) 0.20 mm(brd. thk. ≤ 2.80 mm)
Hole Position Tol. ±3 mil ±3 mil
PTH Dia. Tol. ±3 mil ±3 mil
NPTH Dia. Tol. ±2 mil ±2 mil, +2 mil - 0 mil, 0 mil - (-2) mil
Pressfit Hole Dia. Tol. ±2 mil ±2 mil
Drilled Slot Hole Tol. ±0.05(L)/0.05(W) mm(unplated)
±0.13(L)/0.10(W) mm(plated)		 ±0.05(L)/0.05(W) mm(unplated)
±0.13(L)/0.10(W) mm(plated)
Milled Slot Hole Tol. ±0.10(L)/0.10(W) mm(unplated)
±0.13(L)/0.13(W) mm(plated)		 ±0.10(L)/0.10(W) mm(unplated)
±0.13(L)/0.13(W) mm(plated)
Backdrill Depth Tol. ±4 mil ±4 mil
Counter Bore/Sink Hole Angle Tol. ±10° ±10°
Counter Bore/Sink Hole Dia. Tol. ±0.20 mm ±0.20 mm
Counter Bore/Sink Hole Depth Tol. ±0.15 mm ±0.15 mm
Inner Layer Base Copper VS Line Width/Space 18um (1/2OZ) 3/3mil 2.5/2.5mil
35um (1OZ) 3.5/3.5mil or 3/4mil 3.5/3.5mil or 3/4mil
70um (2OZ) 5.5/5.5mil 5.5/5.5mil
105um (3OZ) 6.5/6.5mil 6.5/6.5mil
140um (4OZ) 8/8mil 8/8mil
175um (5OZ) 10/10mil 10/10mil
210um (6OZ) 12/12 mil 12/12 mil
Outer Layer Base Copper VS Line Width/Space 7-9um 3/3mil 3/3mil
12um 3.5/3.5mil 3.5/3.5mil
18um (1/2OZ) 4.5/4.5mil 4.5/4.5mil
35um (1OZ) 5/5mil 5/5mil
70um (2OZ) 9/9mil 8/8mil
105um (3OZ) 10/10mil 10/10mil
140um (4OZ) 13/13mil 10/13mil
175um (5OZ) 14/14mil 12/15mil
Copper Feature Min. Annular Ring 4 mil 4 mil(partially 3.5 mil)
Min. BGA Pad Dia. 10 mil(excluding H.A.L) 8 mil(excluding H.A.L)
Min. BGA Pad Dia. for Leaded H.A.L. 10 mil 10 mil
Min. BGA Pad Dia. for Lead-free H.A.L. 12 mil 12 mil
Min. Pad Size for H.A.L. 7 mil * 16 mil 7 mil * 16 mil
Solder Mask Color Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange
Min. Soldermask Web 0.10 mm 0.075 mm
Min. Soldermask to Pad Clearance 0.10 mm 0.10 mm
Min. Soldermask Track Cover 0.10 mm 0.10 mm
Soldermask Thk. on Copper 10 um - 18 um 10 um - 18 um
Soldermask Thk. at Shoulder ≥ 5 um(one-time printing) ≥ 5 um(one-time printing)
Soldermask Thk. over Hole ≥ 5 um ≥ 5 um
Legend Color White, Yellow, Black, Orange White, Yellow, Black, Orange
Min. Stroke Width 0.17 mm 0.17 mm
Min. Height for Legibility 1.00 mm 1.00 mm
Min. Legend to Pad Clearance 4 mil 4 mil
Profiling Panelization V-score, Tab-routing, Tab-routing & Perforation,
Tab-routing & V-score, Tab-routing & V-score & Perforation		 V-score, Tab-routing, Tab-routing & Perforation,
Tab-routing & V-score, Tab-routing & V-score & Perforation
V-score Angle 20°, 30°, 60° 20°, 30°, 60°
Brd. Thk. for Double-side V-score 0.80 mm - 3.20 mm 0.80 mm - 3.20 mm
Brd. Thk. for Single-side V-score 0.60 mm - 0.80 mm 0.60 mm - 0.80 mm
Min. Inside Corner Radius 0.40 mm 0.30 mm
Gold Fingers/Edge Connectors Edge Beveling Angle 30°, 45° 30°, 45°
Edge Chamfering Corner 45° 45°
Min. Notch Width beside Edge Connector 0.20 mm 0.20 mm
Edge Beveling Depth 0.50 mm 0.50 mm
Min. Finger Top to Copper Distance 3.00 mm 2.00 mm
Min. Finger Bot. to Brd. Outline 7.00 mm 6.00 mm
Min. Finger to Finger Clearance 6 mil 5 mil
Edge Beveling Angle Tol. ±5° ±5°
Edge Beveling Remaining Thk. Tol. ±5 mil ±5 mil
Profile Brd. Dimension Tol. ±0.10 mm ±0.10 mm
Inside Cutout Position Tol. ±0.10 mm ±0.10 mm
V-score Angle Tol. ±5° ±5°
V-score Web Thk. Tol. ±0.05 mm ±0.05 mm
V-scores Offset Tol. ±0.10 mm ±0.10 mm
Others Brd. Thk. for Epoxy Fill 0.50 mm - 6.50 mm 0.40 mm - 6.50 mm
Min. Channel for Internal Split Plane 8 mil 8 mil
Bow & Twist 0.75% 0.50%
Brd. Thk. Tol. ±0.10 mm(thk.≤1.00 mm), ±10%(thk.>1.00 mm) ±0.10 mm(thk.≤2.00 mm), ±0.15(2.10≤thk.≤3.00 mm)
Impedance Control Tol. ±5Ω(<50Ω), ±10%(≥50Ω) ±5Ω(<50Ω), ±8%(≥50Ω)
Trace Width/Space Tol. ±1.0 mil(≤10 mil), ±1.5 mil(>10 mil) ±1.0 mil(≤10 mil), ±1.5 mil(>10 mil)
Layer to Layer Registration Tol. ≤2 mil ≤2 mil
Min. Trace Width/Space for Epoxy Fill 4.0 mil / 4.0 mil 3.5 mil / 3.5 mil