Layer Count: 10
Thickness: 2.60 mm
Panel Size: 181.00 * 182.50 mm
Min. Hole: 8.00 mil
Aspect Ratio: 12.80:1
Min. Trace/Space: 4.0/4.06 mil
Surface Finish: ENIG
Additional Features:
2 Level HDI
Controlled Impedance
8 mil BGA
Application: Medical

Layer Count: 8
Thickness: 1.57 mm
Panel Size: 213.68 * 119.49 mm
Min. Hole: 8 mil
Aspect Ratio: 7.73:1
Min. Trace/Space: 4.0/8.80 mil
Surface Finish: ENIG
Additional Features:
3 Level HDI
8 mil BGA
20uin gold fingers
Application: Security

Layer Count: 28
Thickness: 5.08 mm
Min. Hole: 24.00 mil
Aspect Ratio: 8.33:1
Min. Trace/Space: 6.0/6.80 mil
Surface Finish: ENIG
Additional Features:
3 Level HDI
Controlled impedance
Depth-controlled drill
Application: Semiconductor Test

Layer Count: 4
Thickness: 1.60 mm
Min. Hole: 8 mil
Aspect Ratio: 7.87:1
Min. Trace/Space: 3.50/8.0 mil
Surface Finish: ENIG
Additional Features:
1 pressing cycle
1 cycle laser drill
Resin Fill 1 cycle
BGA to Conductor 4 mil
Application: Automotive

Layer Count: 6
Thickness: 1.60 mm
Panel Size: 356.16 * 224.50 mm
Min. Hole: 8 mil
Aspect Ratio: 7.87:1
Min. Trace/Space: 4.2/6.0 mil
Surface Finish: ENIG
Additional Features:
DRL5-6 (4 mil)
1 pressing cycle
Laser drill 1 cycle
Resin Fill 1 cycle
Application: Consumer Electronics

Layer Count: 12
Thickness: 1.60 mm
Panel Size: 242.50 * 140.08 mm
Min. Hole: 8.0 mil
Aspect Ratio: 7.87:1
Min. Trace/Space: 5.0/8.80 mil
Surface Finish: ENIG
Additional Features:
Via-In-Pad
20uin gold fingers
Laser drill 2 cycles
Resin Fill 1 cycle
Application: Industrial Control

Layer Count: 18
Thickness: 4.0 mm
Panel Size: 340.09 * 330.98 mm
Min. Hole: 28 mil
Aspect Ratio: 5.62:1
Min. Trace/Space: 12.0/16.08 mil
Surface Finish: ENEPIG
Additional Features:
Copper Fill 2 cycles
3 pressing cycles
2 Level HDI
Controlled impedance
Application: Semiconductor Test

Layer Count: 18
Thickness: 3.20 mm
Panel Size: 344.96 * 319.83 mm
Min. Hole: 8 mil
Aspect Ratio: 15.75:1
Min. Trace/Space: 6.0/6.0 mil
Controlled Impedance: Yes
Surface Finish: ENIG
Additional Features:
1 mechanical drill
3 pressing cycles
Laser drill 2 cycles
Application: Semiconductor Test