Rigid-flex and Flex PCB

Layer Count: 4
Thickness: 0.8 mm
Panel Size: 248.56 * 101.00 mm
Min. Hole: 8.0 mil
Aspect Ratio: 3.94:1
Min. Trace/Space: 8.0/24.36 mil
Surface Finish: ENIG
Additional Features:
Drill to Conductor 0.1 mm
Via-In-Pad

Layer Count: 4
Thickness: 0.3 mm
Panel Size: 188.56 * 119.00 mm
Min. Hole: 6.0 mil
Aspect Ratio: 1.97:1
Min. Trace/Space: 2.5/3.0 mil
Surface Finish: ENIG
Additional Features:
Drill to Conductor 0.1 mm

Layer Count: 6
Material: Panasonic PI + FR4 Tg170
Thickness: 0.5 mm
Panel Size: 144.50 * 188.64 mm
Min. Hole: 7.87 mil
Aspect Ratio: 2.5:1
Min. Trace/Space: 2.5/3.0 mil
Surface Finish: ENIG
Additional Features:
2 Level HDI
Via-In-Pad

Layer Count: 4
Thickness: 0.3 mm
Panel Size: 212.60 * 119.00 mm
Min. Hole: 10.0 mil
Aspect Ratio: 1.18:1
Min. Trace/Space: 4.0/6.68 mil
Surface Finish: ENEPIG
Additional Features:
Via-In-Pad
Drill to Conductor 0.1 mm

Layer Count: 12
Thickness: 1.60 mm
Panel Size: 80.26 X 218.88 mm
Min. Hole: 10 mil
Aspect Ratio: 6.3:1
Min. Trace/Space: 7.8/10.0 mil
Surface Finish: ENIG

Layer Count: 2
Thickness: 0.13mm
Min. Hole: 6.0mil
Min. Trace/Space: 6.0/8.78 mil
Surface Finish: ENIG
Additional Features:
1 * 15 mm slots

Layer Count: 2
Thickness: 0.1 mm
Min. Hole: 8 mil
Min. Trace/Space: 2.5/2.5 mil
Surface Finish: ENIG

Layer Count: 2
Thickness: 0.12mm
Min. Hole: 6.0 mil
Min. Trace/Space: 2.0/2.50 mil
Surface Finish: ENIG