Layer Count: 16
Thickness: 2.0 mm
Min. Hole: 8.0 mil
Aspect Ratio: 9.84:1
Min. Trace/Space: 6.0/6.0 mil
Surface Finish: ENIG
Additional Features:
Controlled Impedance
Resin Filled Vias

Layer Count: 18
Thickness: 2.62+/-0.157 mm
Panel Size: 182 * 180 mm
Min. Hole: 9.84 mil
Aspect Ratio: 10.48:1
Min. Trace/Space: 3.94/4.9 mil
Controlled Impedance: Yes
Surface Finish: ENIG
Application: Medical

Layer Count: 14
Thickness: 1.60 mm
Panel Size: 318.26 * 180 mm
Min. Hole: 8.0mil
Aspect Ratio: 7.87:1
Min. Trace/Space: 3.0/3.06 mil
Surface Finish: ENIG
Additional Features:
8mil BGA, Resin Fill
Controlled Impedance
Application: Security

Layer Count: 16
Thickness: 2.14 mm
Panel Size: 269.00 * 172.62 mm
Min. Hole: 12.00 mil
Aspect Ratio: 7.02:1
Min. Trace/Space: 22.00/34.04 mil
Surface Finish: ENIG
Application: Communication

Layer Count: 18
Thickness: 2.36 mm
Panel Size: 304.96 * 186.50 mm
Min. Hole Size: 12.00 mil
Aspect Ratio: 7.74:1
Min. Trace/Space: 3.0/8.0 mil
Surface Finish: ENIG
Application: Consumer Electronics

Layer Count: 28
Thickness: 5.03 mm
Panel Size: 433.06 * 373.20 mm
Min. Hole: 20.62 mil
Aspect Ratio: 9.60:1
Min. Trace/Space: 6.0 /8.32 mil
Surface Finish: ENIG
Additional Features:
Backplane
Application: Industrial Control

Layer Count: 22
Thickness: 5.00 mm
Panel Size: 403.50 * 404.50 mm
Min. Hole: 24.06 mil
Aspect Ratio: 8.18: 1
Min. Trace/Space: 10.00/10.00 mil
Surface Finish: ENEPIG
Additional Features:
Stepped Hole
Application: Semiconductor Test

Layer Count: 16
Thickness: 3.8 mm
Min. Hole: 10 mil
Aspect Ratio: 14.96:1
Min. Trace/Space: 4.00/3.91 mil
Cu Thk.: 5/2/1/…/1/2/5 OZ
Additional Features:
1-3 & 14-16 stacked microvias
2 pressing cycles
Resin Fill 2 cycles
Depth-controlled drill
Blind Slot Routing