Layer Count: 14
Thickness: 1.60+/-0.15 mm
Panel Size: 335.68 * 290.83 mm
Min. Hole: 7.90 mil
Min. Trace/Space: 9.84/6.07 mil
Surface Finish: ENIG
Additional Features:
30uin gold fingers
Application: Industrial Control

Layer Count: 12
Thickness: 2.50 mm
Min. Hole: 12.00 mil
Aspect Ratio: 8.2:1
Min. Trace/Space: 8.00/36.07 mil
Surface Finish: ENEPIG
Additional Features:
Counterbore Holes
Application: Semiconductor Test

Layer Count: 10
Thickness: 1.80 mm
Min. Hole: 8.0 mil
Aspect Ratio: 8.86:1
Min. Trace/Space: 3.0/3.0 mil
Surface Finish: ENIG
Additional Features:
High-precision coil
Controlled impedance
Application: Industrial Control

Layer Count: 22
Thickness: 4.64 mm
Min. Hole: 42.08 mil
Aspect Ratio: 4.34:1
Min. Trace/Space: 4.0/7.8 mil
Surface Finish: 20uin Hard Gold
Additional:
Edge Plating
Application: Industrial Control

Layer Count: 6
Thickness: 1.10 mm
Min. Hole: 8.0 mil
Min. Trace/Space: 12.0/16.0 mil
Surface Finish: 50uin hard gold
Additional Features:
Edge Castellation
Application: Military

Layer Count: 8
Thickness: 2.36 mm
Min. Hole: 18.64 mil
Aspect Ratio: 4.99:1
Min. Trace/Space: 14.0/18.20 mil
Surface Finish: ENIG
Additional Features:
Peelable mask
Controlled impedance
Outer layers 4OZ copper
Application: Automotive

Layer Count: 8
Thickness: 1.60 mm
Min. Hole: 8.0 mil
Aspect Ratio: 7.87:1
Min. Trace/Space: 4.0/8.0 mil
Surface Finish: ENIG
Additional Features:
20uin Gold Fingers
Resin Filled Vias
Application: Communication

Layer Count: 8
Thickness: 1.57 mm
Min. Hole: 12 mil
Aspect Ratio: 5.15:1
Min. Trace/Space: 7.87/8.60 mil
Surface Finish: ENIG
Additional Features:
Edge Castellation
Outer layers 3OZ copper
Application: Industrial Control